Camila Pereira Sousa1,2, Jean-Lynce Gnanago1, Valernst Gilmus1, Tony Gerges1, Philippe Lombard1, Michel Cabrera1, Hugo Dorez2, and Simon August Lambert1
1Université de Lyon, INSA Lyon, Université Claude Bernard Lyon 1, Ecole Centrale de Lyon, CNRS, Ampère UMR5005, Villeurbanne, France, 2Hawkcell, Marcy l'Etoile, France
Synopsis
In the last few years, there has been an increasing
interest from the scientific community in the fabrication of flexible coils.
Several methods can be used for the manufacture of flexible coil, mainly
screen-printed coils on flexible substrates. In this work, three different
screen printing coils with different layers of silver ink were manufactured and
their quality factors were measured on bench. A MR-coil combining
screen-printed process with electrodeposition step was also built. The
additional manufacture step allowed improving drastically Q factor of our
screen-printed coil with more than one order of magnitude while maintaining
good flexibility of the substrate.
Introduction
The MR-coil is the component of the MRI system
by which MRI signal is stimulated and received1. This MR-coil is so
much more sensitive to tissue signal that it is fitting the shape of the sample
2.However, standard manufacturing process lacks of flexibility and
adaptability to fit complex 3D shapes. Therefore, in the past years, the need
for new manufacturing methods of MR-coils
has become mandatory. Corea et al. [2] presents the first fully functional, screen-printed
and flexible MR-coils using PEEK film substrate (75 µm thickness). Due to higher
resistivity of silver inks than bulk copper screen-printed process require superposition
of layers which may lead to stiffening of flexible substrate and higher risk of
layers misalignment. More recently and with a different approach, Gerges et al
[3] deposited MR-coil traces directly on the 3D surface of rigid polymer
substrates, to build a MRI setup for rodent brain and small samples. In this
case, copper traces were built using a combination of electroless deposition
with electrodeposition steps which leads to resistivity of traces close to bulk
copper. To date, this has not been tested on flexible substrate. Here, we
investigate the possibility of using electrodeposition to improve screen printed
coils.Methods
MR-coil geometry was a square with 40mm length and 3mm
width. The loop around the MR-coil was made for inductive decoupling when used
in a phased array coil. Four MR-coils have been manufactured, on a 500 µm thick
polycarbonate substrate, using screen-printed process. Dupont ME603 silver ink
was used to deposit 1 layer of tracks for coil (1) and coil (2), 3 layers for
coil (3) and 5 layers for coil (4). All coils were then cured at 120°C for 20
min in air. After drying, a copper
thickness was deposit on the coil (1) using electroplating. To tune the MR-coil
at 64MHz, ceramic capacitors (Exxcelia High Q capacitors) were electrically
connected to the coil traces using tin soldering for coil (1) and electrically conductive
adhesive (DuPont ME902) for coils (2),(3) and (4). Figure 1 shows a picture of the
manufactured MR-coils (1-4).
The electrical resistivity ρ of the manufactured coils
was calculated using equation : ρ = R A/l, where R is the resistance of the silver trace, which
is measured with four-point probe on a length l and cross-sectional area A
measured using an optical profilometer (Nano-Point-Scanner (NP3)).
For the comparison purposes, the same coil was made by
using an FR4 substrate (coil (5)).
The coil sensitivity was evaluated from measurement of
the unloaded quality factor. This was performed using the single loop method4
with a Vector Network Analyzer (R&S ZNL3) and a homemade 1cm diameter
coaxial loop. Results
As expected, the resistivity of the MR-coil decreases
when increasing the amount of silver layers (Table 1). The measured quality
factors increase when adding more layers of silver ink (Table 1). The
electrodeposited coil has a low resistivity and a high conductance (equivalent
to copper) and presented of 165 which was similar to the one obtained
with the FR4 substrate, of 158. Qualitatively, flexibility of the
substrate seemed not to be altered by the electroplating of the one layer screen-printed
coil. Discussions
In order to compare our results with Corea et al. [5],
the measured Q factors of MR-coils (1-3) were extrapolated using scaling rule
defined in Darrasse et al [6] for non-conductive samples. The Q factor scale
with the product of the square root of the frequency by the size of the MR-coil.
Figure 2 presents a superposition of Corea’s results and our measurements with
similar values. The MR-coils made with PC has similar Q factor than the ones
reported in [5] using a PET substrate which can be explained by similar
dielectric loss for both substrate. Nevertheless, our manufactured MR-coil has a
quality factor that has not reached a stable value which should be investigated
in further studies by increasing thickness deposit. The electroplating step allowed
improving drastically Q factor of our screen-printed coil with more than one
order of magnitude. The designed and characterized coils will be tested in
imaging condition on a 1.5T MRI with a phantom to validate the increased signal
to noise ratio compared to screen printed coils. Acknowledgements
The financial support provided by Ingénierie@Lyon, member of the Carnot Institutes Network (Metafab 3D project) for the postdoctoral scholarship of Dr T. Gerges is acknowledged. References
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