Louai Aldayeh1, Mizan Rahman1, and Ross Venook1
1Boston Scientific, Valencia, CA, United States
Synopsis
For patients with more than one MR Conditional implant, it
is unclear how to choose appropriate scanning conditions, as interactions between
neighboring devices are generally not well characterized.
This work assesses how lead electrode heating of an IPG/lead
based system can be impacted by the presence of a neighboring IPG/lead based
system at moderate distances (~15cm).
The results demonstrate that lead electrode heating can
either decrease or increase, depending on the relative location of the neighboring
device.
The potential implication is that established conditions for
MR safety of one implant may not be appropriate in the presence of neighboring implant.
INTRODUCTION
Some patients have multiple MR Conditional active implantable
devices (e.g., a cardiac pacemaker and a deep brain stimulator (DBS); a spinal
cord stimulator (SCS) and a deep brain stimulator; or multiple devices of the
same type). In these scenarios, the MRI exposure safety limits of the two
systems may not be equivalent, and prescribing appropriate scan conditions can
be challenging for clinicians. Previous
work has investigated potential complicating factors of testing induced heating
in implantable systems, including abandoned leads with different proximal
capping [1], effects of partial implantation [2], and effects of multiple
adjacent tissue simulating media [3].
This work investigates the potential for second-order interactions
between neighboring devices that can impact RF-induced heating measurements and
safety assessments.METHODS
Using established measurement techniques, with an ASTM
phantom in a 1.5T birdcage, and high conductivity medium (HCM) gel [4], two
separate implantable pulse generator (IPG) systems (each having: one IPG, one
55cm lead extension and one lead) were tested for lead electrode heating using
fiber optic temperature probes (Neoptix, Qualitrol, Fairport, NY). The two
implants were mounted in the ASTM phantom as illustrated in Figure 1, with a
consistent 15cm parallel distance along the majority of their trajectories.
Three system setups/lead routings were tested:
- One single-lead IPG system
(with 55cm lead extension and 30cm lead), on either the right or left side of
the phantom. See the gray colored scenarios in Figure 2.
- One dual-lead IPG system (with
two 55cm lead extensions and one each of 30cm & 45cm leads), on either the
right or left side of the phantom. See
the blue colored scenarios in Figure 2.
- Two separate single-lead IPG
systems (each with one IPG, one 55cm lead extension and one 30cm lead). See the
orange colored scenario in Figure 2.
In addition, all above scenarios were retested with a range
of distal lead-end distance proximities (left to right distal array separation distances
of 15cm, 13cm, 11cm, 9cm, 7cm, 5cm & 3cm, as indicated by dotted lines in
Figure 2).
All tests were done under nominally equivalent exposure
conditions, as measured by an E-field probe (EX3DV4, Speag, Zurich, Switzerland)
at a consistent high-SNR location at a distance from any test objects (“E-field
Ref” red dot in Figures 1 and 2).
RESULTS
All heating results are reported (in normalized units) in
Figures 3 and 4.
Figure 3 reports all measurement results of the left side of
the ASTM phantom.
Figure 4 reports all measurement results of the right side
of the ASTM phantom.
The three groups of results are: left-group for blue layout scenario
(one dual-lead IPG system), center- group for orange layout scenario (two
separate single-lead IPG systems), and right-group for the gray layout scenario
(one single-lead IPG system).DISCUSSION
From Figure 3, the left ASTM side results show that heating
of the left-side system by itself (gray layout) was higher compared to when
another system was mounted 15 cm away (orange layout). As a check point for one
IPG with dual lead mounted (blue layout), heating is even lower than both comparison
scenarios.
From Figure 4, the right ASTM side results show that heating
of the right-side system by itself (gray layout) was lower compared to when another
system was mounted 15 cm away (orange layout). As a check point for one IPG
with dual lead mounted (blue layout), heating is even lower than both comparison
scenarios. For an estimate of percentage
increase of heating for a single-lead system with or without a neighboring
system, Figure 5 shows a 10% increase in heating with 5cm distal array
separation and 26% increase with 13cm distal array separation.
As shown, implants mounted on the left ASTM side exhibited
results that are different from implants mounted on the right ASTM side. These
differences are attributed to various factors, such as lead/IPG routing as well
as birdcage fields that depend on polarization [5].
The overall results show that lead heating of an IPG/lead
based implant can either increase or decrease in the presence of a neighboring
system that is up to 15cm away.CONCLUSION
Implant lead heating measurements of IPG/lead based systems are
impacted (can increase or decrease) by the presence of another implant nearby. MR Conditional safety evaluations and labeling
should consider such scenarios appropriately.Acknowledgements
No acknowledgement found.References
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